Background

Photovoltaic (PV) modules are a high-tech innovation hub at the manufacturing end. On one hand, they promote technological innovation and integration in the upstream, especially in cells, wafers, welding, and encapsulating. On the other hand, they facilitate downstream product application innovation based on the "PV+" concept, driving market penetration. The integration of upstream and downstream technologies centered around modules is ushering PV into a new stage of development, presenting new opportunities for growth. Meanwhile, continuous breakthroughs in N-type cell technologies such as HJT, TOPCon, and xBC have significantly improved conversion efficiency through technologies like 0BB (no busbar), half-cut edge passivation, laser induced firing, high-density grids, and high-density encapsulating, pushing the performance of PV modules to new heights.

The cost reduction and efficiency improvement of the PV industry are also attributed to the continuous progress of module encapsulating technology and materials. With the transformation of new cell technology, the bifacial dual-glass, higher power demand and multi-application of PV modules have led to a major revolution in the encapsulating material market. 0BB, perovskite, and tandem cell technologies have put forward more requirements for the application and selection of adhesive films. Related modules are applied in various places such as buildings, mountains and water surfaces, with diverse application scenarios and module performance requirements. At the same time, it promotes the R&D of high-efficiency, environmentally friendly, and weather-resistant PV functional material technology, which brings new opportunities and challenges to the upstream and downstream enterprises of encapsulating materials.

In recent years, with the popularity of different application projects such as sand dune, offshore photovoltaic and "photovoltaic+", the development of N-type module technology can play a better performance. In terms of module products, more innovations are targeted at niche markets. For example, salt-resistant and anti-corrosion technology in the mudflat scenario, and anti-dust and wind-resistant technology in the sand dune scenario. Based on the high efficiency and low cost brought by the scale effect of the technology industry, products can achieve rapid response and iteration for different application scenarios, and can also provide a variety of customized products to meet different market demands.

Various advanced technologies are helping N-type modules achieve higher power. High-density module technologies such as 0BB, stacked grid, stacked tile, stacked solder, and micro/zero-distance interconnection have become mainstream in N-type modules. To further enhance the power and practicality of modules, new encapsulating materials such as lightweight encapsulating, flexible encapsulating, functional backsheets, reflective films, gap films, and backsheet light-converting coatings have been applied. In addition, module technologies suitable for the distributed market, such as all-black aesthetic modules or xBC-type modules, are receiving industry attention.

Novel PV Encapsulating Materials and Multi Scenario Module Application Forum 2024 will be held on October 22 in Suzhou, Jiangsu, China. The conference will explore the global N-type module market and its demand for photovoltaic polymers and materials, TOPCon, HJT and xBC module encapsulating technology and encapsulating materials, the selection of POE, EPE, EVA, and PVB films in different scenarios, the technological trends and supply and demand outlook of PV glass, films, and backplane technology, advanced module technologies such as 0BB, light conversion films, gap films, shingles, stack welding, stack grids, micro/zero-distance interconnection, high-reflective black backplane, lightweight front plate, lightweight module backplane, fluorine-free backplane, BIPV module, deserts, gobi desert and desert regions modules, and offshore PV module technology. This conference will provide ZOOM Global Online Participation and simultaneous interpretation in Chinese and English.

Topics

1. Global PV Industry Outlook and N-type Module Market Analysis

2. HJT, TOPCon, and xBC module encapsulating technology and encapsulating materials

3. Supply, demand, and price trends of PV polymers and materials

4. Selection of POE, EPE, EVA, and PVB films in different scenarios

5. System sharing and application advantages of composite material frames

6. 0BB technical route: integrated film coating, adhesive printing, welding + dispensing

7. Research on laser non-destructive cutting and half-chip passivation edge technology

8. Laser induced firing technology enhances the reliability of TOPCon cells

9. DH aging and PID analysis of different encapsulating schemes for TOPCon modules

10. Advantages and technical implementation path of HJT modules without busbar encapsulating

11. 0BB encapsulating process using busbar-carrying film

12. Optimization of dispensing welding 0BB process technology and advanced adhesive bonding

13. Gap film technology helps improve module efficiency

14. Multi-scenario application and module selection of PV power stations

15. Insulating film technology and application serving xBC modules

16. N-type module high-reflective black backsheet, lightweight backsheet, and fluorine-free backsheet

17. Progress in advanced PV glass and glass coating technology

18. Performance attenuation and reliability evaluation of PV modules

19. High-density module technologies and equipment such as shingling, stacking, interdigitating, micro/zero-pitch interconnection, etc

20. N-type BIPV modules, deserts, gobi desert & desert regions modules and offshore PV module technology

Program

Oct. 21

17:00-20:00  Pre-conference Registration 

Oct. 22

08:30-12:30  Speech

12:30-14:00  Networking Lunch

14:00-18:30  Speech

18:30-20:00  Banquet